EDAPS

EDAPS


EDAPS

EDAPS

EDAPS

EDAPS

EDAPS


EDAPS

Amkor



EDAPS


IBM

RS



EDAPS

EPS


TEMIAC


MS_Taiwan


EDAPS

MOST


MEA


NSYSU


NUK


NTU


Welcome to EDAPS!

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemmination of latest research in the areas of electrical design of chip, package and system. Designers and researchers across the world come forth to share and discuss their work on all aspects of electrical packaging including modeling, design and simulation, fabrication and characterization. This symposium consists of technical paper presentation, poster sessions, industry exhibits, workshops and tutorials.

Shenzhen is an energetic city crowned as the World's Factory. It is also the modern technology power house of China. Almost all international companies have their presences in Shenzhen. Its demands for novel technologies and its unlimited opportunities in Shenzhen amaze the world. IEEE EDAPS meets its thirsty in the rocketing IC and electronics technology development. Conference participants can also witness frontier challenges from front fields that could be your next novel breakthrough.

EDAPS is sponsored by the IEEE Electronic Packaging Society.

EDAPS will be an excellent forum to highlight the latest advances in the high-speed and high-performance semiconductor industry. Engineers and researchers will engage in the 3 full day conference and workshop, to be held during December 14-16 in Shenzhen. The forum offers a great opportunity for sponsorships and for the related companies to build their brands in this leading international platform.